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STNRGPF01TR - STMicroelectronics

Description: Power Factor Correction Controller 38-Pin TSSOP T/R

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STNRGPF01TR - STMicroelectronics - PCB symbol
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STNRGPF01TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP38
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STNRGPF01TR - STMicroelectronics - 3D model - Small Outline Packages - TSSOP38
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STNRGPF01TR Details

  • Manufacturer Part Number:

    STNRGPF01TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-38

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-02-23

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    HAS LOW LEVEL AND HIGH LEVEL O/P CURRENT AS 7.75 MILLI AMP AND 3 MILLI AMP

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G38

  • Length:

    9.7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    34 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

STNRGPF01TR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4969, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor values depend on the input voltage, output voltage, and switching frequency. A general guideline is to use a minimum of 10uF ceramic capacitors with a voltage rating of at least 1.5 times the input voltage. However, it's recommended to consult the application note AN4969 and perform simulations to determine the optimal capacitor values for your specific design.
  • While the datasheet specifies an operating temperature range of -40°C to 150°C, the maximum ambient temperature for reliable operation depends on the specific application and cooling conditions. As a general guideline, it's recommended to keep the ambient temperature below 125°C to ensure reliable operation and minimize thermal stress.
  • To ensure EMC compliance, follow the guidelines in the application note AN4969, which includes recommendations for PCB layout, component selection, and shielding. Additionally, perform EMC testing and simulation to ensure your design meets the required standards and regulations.
  • The recommended output capacitor value and type depend on the output voltage, output current, and switching frequency. A general guideline is to use a minimum of 10uF ceramic capacitors with a voltage rating of at least 1.5 times the output voltage. However, it's recommended to consult the application note AN4969 and perform simulations to determine the optimal capacitor values for your specific design.

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STNRGPF01TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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