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STP08CP05B1 - STMicroelectronics

Description: Low voltage, low current power 8-bit shift register

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STP08CP05B1 - STMicroelectronics - PCB symbol
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STP08CP05B1 - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP-16
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STP08CP05B1 - STMicroelectronics - 3D model - Dual-In-Line Packages - DIP-16
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STP08CP05B1 Details

  • Manufacturer Part Number:

    STP08CP05B1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Data Input Mode:

    SERIAL

  • Display Mode:

    SEGMENT

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.1 mm

  • Supply Current-Max:

    13.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • fmax-Min:

    30 MHz

STP08CP05B1 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2349, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within its specified temperature range.
  • The maximum allowable voltage on the output pins of the STP08CP05B1 is VCC + 0.5V, as specified in the datasheet. Exceeding this voltage can damage the device or affect its reliability.
  • The STP08CP05B1 is not designed for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a moisture-resistant coating or conformal coating to protect the device from moisture ingress.
  • STMicroelectronics recommends following the JEDEC J-STD-020D.1 standard for soldering the STP08CP05B1. This standard provides guidelines for temperature, time, and other parameters to ensure reliable solder joints.

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STP08CP05B1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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