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STPS30L45CR - STMicroelectronics

Description: Low drop power Schottky rectifier, 45 V, -65 to + 150 °C

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PCB Footprints
STPS30L45CR - STMicroelectronics PCB footprint - Other - Other - I2PAK_2026-1.9
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3D Models
STPS30L45CR - STMicroelectronics  - 3D model - Other - I2PAK_2026-1.9
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STPS30L45CR Details

  • Manufacturer Part Number:

    STPS30L45CR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.74 V

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    220 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    400 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STPS30L45CR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STPS30L45CR is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate within the -40°C to 125°C range for optimal performance and reliability.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point above 217°C to prevent damage to the device. It's also recommended to use a reflow oven or a skilled soldering technician to avoid overheating or cold joints.
  • For optimal thermal management, it's recommended to use a PCB with a thermal pad and a heat sink. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow and minimal thermal resistance between the device and the heat sink.
  • When designing and testing with the STPS30L45CR, ensure that your test equipment and PCB are rated for the device's high voltage and current capabilities. Use proper safety precautions, such as wearing protective gear and ensuring a safe working distance, to avoid electrical shock or injury.
  • The STPS30L45CR is designed to meet high reliability standards, with a typical lifespan of 10-15 years or more, depending on operating conditions and usage. However, it's essential to follow proper design, manufacturing, and testing guidelines to ensure the device meets its expected lifespan.

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STPS30L45CR Overview

Use the download button to access the STPS30L45CR schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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