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STPS3L45AF - STMicroelectronics

Description: Schottky Diodes & Rectifiers Pwr Schtky Rectifier 3A 45V 0.465V

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STPS3L45AF - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - STPS2L40AF
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3D Models
STPS3L45AF - STMicroelectronics  - 3D model - Small Outline Diode Flat Lead - STPS2L40AF
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STPS3L45AF Details

  • Manufacturer Part Number:

    STPS3L45AF

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.57 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

STPS3L45AF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
  • To ensure the device is properly biased, make sure to connect the enable pin (EN) to a logic high level, and the input voltage (VIN) to a stable DC voltage source within the recommended operating range. Also, ensure that the output capacitor (COUT) is properly sized and placed close to the device to minimize parasitic inductance.
  • When selecting the output capacitor (COUT), consider the following: choose a capacitor with a low equivalent series resistance (ESR) and a high ripple current rating. The capacitor value should be within the recommended range (e.g., 10uF to 22uF for the STPS3L45AF). Ensure the capacitor is placed close to the device to minimize parasitic inductance.
  • The device's power-on reset (POR) and under-voltage lockout (UVLO) features are designed to ensure the device operates within a safe voltage range. To handle these features, ensure that the input voltage (VIN) ramps up slowly during power-on, and that the device is not enabled until the input voltage reaches the minimum operating voltage (VMIN).
  • Thermal design considerations for the device include ensuring good airflow around the device, using a heat sink if necessary, and avoiding thermal interfaces or obstacles between the device and the heat sink. The device's thermal pad should be connected to a solid ground plane to improve thermal conductivity.

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STPS3L45AF Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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