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STPSC4H065B-TR - STMicroelectronics

Description: 650 V, 4 A high surge silicon carbide power Schottky diode

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STPSC4H065B-TR - STMicroelectronics PCB footprint - Other - Other - DPAK_15
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STPSC4H065B-TR Details

  • Manufacturer Part Number:

    STPSC4H065B-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    38 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

STPSC4H065B-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal pad to maintain a low junction temperature. Monitor the device's thermal performance and adjust the system design accordingly.
  • The recommended soldering conditions are: peak temperature = 260°C, time above 217°C = 30 seconds, and the number of reflows = 2. Follow the JEDEC J-STD-020 standard for reflow soldering.
  • Handle the device in an ESD-protected environment. Use ESD-protective packaging, wrist straps, and mats. Ground all equipment and personnel before handling the device. Avoid touching the device's pins or leads.
  • Store the device in a dry, cool place (temperature range: 5°C to 30°C, humidity: 60% RH max). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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STPSC4H065B-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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