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STS4NF100 - STMicroelectronics

Description: STS4NF100, N-channel MOSFET Transistor 4A 100V, 8-Pin SO

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STS4NF100 - STMicroelectronics - PCB symbol
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PCB Footprints
STS4NF100 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - ST SO-8_4
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STS4NF100 - STMicroelectronics - 3D model - Small Outline Packages - ST SO-8_4
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STS4NF100 Details

  • Manufacturer Part Number:

    STS4NF100

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.07 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    52 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    16 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STS4NF100 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Ensure good thermal management, use a heat sink if necessary, and avoid overheating the device. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • For EMI and RFI shielding, ensure that the device is placed in a shielded environment, such as a metal enclosure or a shielded box. Use a multi-layer PCB with a solid ground plane, and consider using EMI-absorbing materials or shielding cans. Also, ensure that all cables and connectors are properly shielded and filtered.
  • To ensure proper power sequencing and voltage ramp-up, follow the recommended power-up sequence, which typically involves powering up the voltage regulators before the STS4NF100. Ensure that the voltage supply is stable and within the recommended range before applying power to the device. Also, consider using a soft-start circuit to control the voltage ramp-up.
  • For testing and measurement, use a 4-wire Kelvin connection to minimize measurement errors. Ensure that the test equipment is properly calibrated, and use a low-noise, low-impedance measurement setup. Consider using a shielded test fixture or a test socket to minimize electromagnetic interference.

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STS4NF100 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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