STTH1002CG-TR footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

STTH1002CG-TR - STMicroelectronics PCB footprint - Other - Other - D2PAK_2022-4

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Part Number STTH1002CG-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D2PAK_2022-4
Released Date Aug 30, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
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STTH1002CG-TR Details

Manufacturer Part Number:
STTH1002CG-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-263
Package Description:
D2PAK-3/2
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.45
Additional Feature:
FREE WHEELING DIODE
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.25 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
50 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Output Current-Max:
8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
200 V
Reverse Current-Max:
5 µA
Reverse Recovery Time-Max:
0.025 µs
Reverse Test Voltage:
200 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

STTH1002CG-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, and that the PCB is designed to dissipate heat efficiently. Also, consider using a heat sink or thermal pad to reduce the junction temperature.
To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Avoid touching the device pins or leads, and use an anti-static wrist strap or mat when handling the device.
To troubleshoot issues with the device, start by checking the power supply voltage and current, and ensuring that the device is operated within the recommended specifications. Check for any signs of overheating, and verify that the PCB layout is correct. Use a logic analyzer or oscilloscope to debug the device's behavior.
When using the device in a high-reliability or safety-critical application, ensure that the device is operated within the recommended specifications, and that the PCB is designed to meet the required safety and reliability standards. Consider using redundant systems, error detection and correction mechanisms, and implementing fail-safe defaults.

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STTH1002CG-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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