STTH1003SBY-TR footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

STTH1003SBY-TR - STMicroelectronics PCB footprint - Other - Other - DPAK_2

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Part Number STTH1003SBY-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - DPAK_2
Released Date Jan 19, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH1003SBY-TR Details

Manufacturer Part Number:
STTH1003SBY-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
15 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.55
Additional Feature:
LOW LEAKAGE CURRENT, LOW POWER LOSS
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.3 V
JESD-30 Code:
R-PDSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
100 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
300 V
Reverse Current-Max:
10 µA
Reverse Recovery Time-Max:
0.035 µs
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

STTH1003SBY-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using thermal interface materials to improve heat transfer.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range to maintain reliability and performance.
To prevent ESD damage, handle the device by the body or pins, avoid touching the pins, and use ESD-protective packaging and workstations. During assembly, use ESD-protective tools and follow proper handling procedures.
The recommended soldering conditions for the STTH1003SBY-TR involve using a soldering iron with a temperature of 250°C (max) and a soldering time of 3 seconds (max). Ensure the device is not exposed to temperatures above 260°C during soldering.

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STTH1003SBY-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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