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STTH1210D - STMicroelectronics

Description: STTH1210D, Fast Recovery Rectifier Diode, Switching 12A max, 1000V 48ns, 2-Pin, TO-220AC

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STTH1210D - STMicroelectronics - PCB symbol
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PCB Footprints
STTH1210D - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC
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STTH1210D - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AC
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STTH1210D Details

  • Manufacturer Part Number:

    STTH1210D

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC

  • Package Description:

    PLASTIC PACKAGE-2

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.09 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH1210D Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing the thermal resistance between the device and the heat sink.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal coupling between the device and the heat sink. Additionally, consider using a thermal interface material to minimize thermal resistance.
  • For EMI filtering and noise reduction, consider using a pi-filter or a common-mode choke, and ensure that the layout is designed to minimize radiation and susceptibility to electromagnetic interference. Also, use a shielded cable and a good grounding scheme to reduce noise.
  • When selecting input and output capacitors, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a high voltage rating, low ESR, and a suitable capacitance value to ensure stable operation and minimize ripple voltage.
  • Critical parameters to monitor during operation include input voltage, output voltage, current, and temperature. Monitoring these parameters helps ensure reliable operation, detects potential faults, and enables timely intervention to prevent damage or failure.

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STTH1210D Overview

Use the download button to access the STTH1210D schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STTH1, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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