A 2-layer or 4-layer PCB with a large copper area for heat dissipation, and a thermal via array under the device is recommended. The PCB should also have a solid ground plane to reduce thermal resistance.
Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Also, consider using a heat sink with a thermal resistance of less than 10°C/W.
The maximum allowed voltage transient on the input pins is ±20 V, with a duration of less than 100 ns. Exceeding this may cause damage to the device.
Use an ESD protection circuit at the input pins, and ensure that the PCB is designed with ESD protection in mind. Handle the device by the body, not the pins, and use an anti-static wrist strap or mat when handling the device.
A soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s is recommended. Avoid exceeding 280°C, as this may cause damage to the device.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
STTH200F04TV1 Overview
Use the download button to access the STTH200F04TV1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like STTH2,
or try a keyword search, such as Rectifier Diodes
About STMicroelectronics
STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components.
STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut
