STTH803G-TR footprint, schematic symbol and 3D model by STMicroelectronics

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STTH803G-TR - STMicroelectronics PCB footprint - Other - Other - STTH803G-TR-1

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Part Number STTH803G-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - STTH803G-TR-1
Released Date Aug 31, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH803G-TR Details

Manufacturer Part Number:
STTH803G-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-263
Package Description:
D2PAK-3/2
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.45
Application:
ULTRA FAST SOFT RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.25 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
100 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Output Current-Max:
8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
300 V
Reverse Current-Max:
20 µA
Reverse Recovery Time-Max:
0.035 µs
Reverse Test Voltage:
300 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE

STTH803G-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using thermal vias.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, use a heat sink or thermal pad, and implement thermal monitoring and shutdown mechanisms to prevent overheating.
Key considerations for EMI and EMC compliance include using a shielded enclosure, minimizing loop areas and wire lengths, using EMI filters, and ensuring proper grounding and shielding of the device and PCB.
To optimize the device for low power consumption, use a low-dropout regulator, minimize quiescent current, use power-saving modes, and optimize the device's operating frequency and voltage.
Recommended test and measurement procedures include using a 4-wire Kelvin connection for accurate voltage measurements, using a high-impedance probe for current measurements, and using a thermal camera or thermocouple for temperature measurements.

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STTH803G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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