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STTH80S06W - STMicroelectronics

Description: 600 V, 80 A Ultrafast Boost Diode

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Symbol
STTH80S06W - STMicroelectronics - PCB symbol
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PCB Footprints
STTH80S06W - STMicroelectronics PCB footprint - Other - Other - DO-247_2022-1
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3D Models
STTH80S06W - STMicroelectronics - 3D model - Other - DO-247_2022-1
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STTH80S06W Details

  • Manufacturer Part Number:

    STTH80S06W

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, SOFT FACTOR IS 0.4

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    DO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    80 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH80S06W Frequently Asked Questions (FAQs)

  • The maximum junction temperature that the STTH80S06W can withstand is 150°C. However, it's recommended to operate the device within a junction temperature range of 25°C to 125°C for optimal performance and reliability.
  • To ensure proper cooling, it's recommended to attach a heat sink to the device, and ensure good thermal contact between the device and the heat sink. The heat sink should be designed to dissipate the maximum power dissipation of the device, which is 80W. Additionally, ensure good airflow around the heat sink to prevent overheating.
  • The recommended PCB layout for the STTH80S06W involves placing the device on a multi-layer PCB with a solid ground plane and a separate power plane. The device's pins should be connected to the power plane through vias, and the ground plane should be connected to the device's ground pins. Additionally, ensure that the PCB layout is designed to minimize parasitic inductance and capacitance.
  • Yes, the STTH80S06W is designed for high-frequency switching applications up to 1MHz. However, it's essential to ensure that the device is properly cooled, and the PCB layout is designed to minimize parasitic inductance and capacitance. Additionally, the device's switching frequency should be limited to prevent overheating and ensure reliable operation.
  • To protect the STTH80S06W from overvoltage and overcurrent, it's recommended to use a voltage regulator or a DC-DC converter to regulate the input voltage. Additionally, consider using overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. The OVP circuit should be designed to trigger at a voltage slightly higher than the device's maximum rated voltage, and the OCP circuit should be designed to trigger at a current slightly higher than the device's maximum rated current.

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STTH80S06W Overview

Use the download button to access the STTH80S06W schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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