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STTH810G - STMicroelectronics

Description: Ultrafast recovery - high voltage diode, 1000V, -65 to + 175 °C

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STTH810G - STMicroelectronics - PCB symbol
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STTH810G - STMicroelectronics PCB footprint - Other - Other - D2PAK_2026-4.4
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STTH810G Details

  • Manufacturer Part Number:

    STTH810G

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-263

  • Package Description:

    D2PAK-3/2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    60 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.085 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH810G Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device. Additionally, ensure that the PCB is designed to minimize thermal resistance, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Although the datasheet specifies a maximum gate-source voltage of ±20V, it's recommended to limit the gate voltage to ±15V to ensure reliable operation and prevent damage to the device.
  • To protect the STTH810G from ESD, it's essential to follow proper handling and storage procedures. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe package. Additionally, consider adding ESD protection components, such as TVS diodes, to the PCB design.
  • A gate drive circuit with a low impedance output and a high current capability is recommended to ensure fast switching times and low power losses. A gate resistor value between 10Ω to 22Ω is typically used, and a gate voltage of 10V to 15V is recommended for optimal performance.

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STTH810G Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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