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STTH812FP - STMicroelectronics

Description: STTH812FP,Diode,ultrafast 1.2KV 8A TO220 STMicroelectronics STTH812FP Switching Diode, 8A 1200V, 2-Pin TO-220FPAC

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PCB Footprints
STTH812FP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FPAC
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3D Models
STTH812FP - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220FPAC
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STTH812FP Details

  • Manufacturer Part Number:

    STTH812FP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC

  • Package Description:

    PLASTIC, TO-220FPAC, 2 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.27

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.9 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Recovery Time-Max:

    0.1 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STTH812FP Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet, but it can be estimated by considering the device's thermal resistance, maximum junction temperature, and power handling. Consult with STMicroelectronics' application notes or support team for guidance.
  • Yes, the STTH812FP is qualified for automotive and high-reliability applications. However, ensure that you follow the recommended design and manufacturing guidelines, and consult with STMicroelectronics' support team for specific requirements.
  • Follow standard ESD protection guidelines, such as using ESD-sensitive handling procedures, and consider adding ESD protection devices or circuits in the design.

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STTH812FP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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