STTH8R04G-TR footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

STTH8R04G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2023-1

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Part Number STTH8R04G-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Diode
Package Category Other
Footprint Name Other - D²PAK_2023-1
Released Date Aug 31, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STTH8R04G-TR Details

Manufacturer Part Number:
STTH8R04G-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-263
Package Description:
D2PAK-3/2
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.45
Additional Feature:
FREE WHEELING DIODE
Application:
ULTRA FAST RECOVERY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.5 V
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
120 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
400 V
Reverse Current-Max:
10 µA
Reverse Recovery Time-Max:
0.05 µs
Reverse Test Voltage:
400 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE

STTH8R04G-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STTH8R04G-TR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (Tj) and adjust the operating conditions accordingly.
The recommended soldering conditions for the STTH8R04G-TR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/s. Use a solder with a melting point of 217°C or higher, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
To handle ESD protection for the STTH8R04G-TR, ensure that all personnel handling the device wear ESD-protective wrist straps or clothing, and that the work surface is ESD-protected. Use ESD-protected packaging and storage materials, and avoid touching the device's pins or leads. Use an ESD-protected workstation and follow proper ESD-handling procedures.
The recommended storage conditions for the STTH8R04G-TR are: temperature range of -40°C to 150°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, ESD-protected environment.

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STTH8R04G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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