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STU3N65M6 - STMicroelectronics

Description: N-channel 650 V, 1.4 Ohm typ., 3.5 A MDmesh M6 Power MOSFET in an IPAK package

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PCB Footprints
STU3N65M6 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK (TO-251)
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3D Models
STU3N65M6 - STMicroelectronics  - 3D model - Transistor Outline, Vertical - IPAK (TO-251)
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STU3N65M6 Details

  • Manufacturer Part Number:

    STU3N65M6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STU3N65M6 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the STU3N65M6 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general rule, it's recommended to operate the device within the specified voltage and current ratings to ensure safe operation.
  • To ensure the STU3N65M6 is properly biased, follow the recommended biasing scheme in the datasheet, which includes setting the gate-source voltage (Vgs) and drain-source voltage (Vds) within the specified ranges. Additionally, ensure the device is operated within the recommended temperature range and provide adequate heat sinking to prevent thermal runaway.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conductivity, such as using a thermal pad or a heat sink attached to the device. Ensure the device is mounted on a PCB with a sufficient copper area to dissipate heat. Additionally, follow the recommended thermal management guidelines in the datasheet, such as keeping the device away from heat sources and using thermal vias to dissipate heat.
  • To protect the STU3N65M6 from electrostatic discharge (ESD), follow proper handling and storage procedures, such as using anti-static bags or wrist straps, and ensuring the device is properly grounded during assembly. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to the PCB design to protect the device from ESD events.
  • The reliability and lifetime expectations for the STU3N65M6 are dependent on various factors, such as operating conditions, temperature, and usage patterns. However, STMicroelectronics provides reliability data and lifetime estimates in the datasheet, which can be used to estimate the device's expected lifetime. Additionally, following proper design and assembly guidelines, as well as ensuring the device is operated within specified ratings, can help to maximize the device's reliability and lifetime.

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STU3N65M6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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