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STU60N55F3 - STMicroelectronics

Description: N-channel 55 V, 6.5 mΩ, 80 A, DPAK, IPAK, D²PAK, I²PAK, TO-220, TO-220FP STripFET™ III Power MOSFET

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STU60N55F3 - STMicroelectronics - PCB symbol
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PCB Footprints
STU60N55F3 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK (TO-251)
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3D Models
STU60N55F3 - STMicroelectronics - 3D model - Transistor Outline, Vertical - IPAK (TO-251)
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STU60N55F3 Details

  • Manufacturer Part Number:

    STU60N55F3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-251

  • Package Description:

    ROHS COMPLIANT, IPAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    390 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.0085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-251

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    110 W

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STU60N55F3 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the STU60N55F3 is not explicitly stated in the datasheet, but it can be calculated using the device's thermal resistance, maximum junction temperature, and power dissipation. A safe operating area analysis should be performed to ensure the device operates within its thermal limits.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Additionally, consider the device's gate-source voltage, drain-source voltage, and current ratings to ensure optimal performance and prevent damage.
  • A good PCB layout and thermal management strategy for the STU60N55F3 involves using a multi-layer board with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidance, but additional resources such as application notes and thermal simulation tools can be helpful.
  • To protect the STU60N55F3 from ESD, follow proper handling and storage procedures, use ESD-safe materials and equipment, and consider implementing ESD protection circuits or devices in the design. The datasheet provides some ESD ratings, but additional precautions may be necessary to ensure device reliability.
  • The reliability and lifetime expectations for the STU60N55F3 depend on various factors such as operating conditions, environmental factors, and design considerations. The datasheet provides some reliability data, but additional information can be obtained from STMicroelectronics' reliability reports, application notes, and technical support resources.

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STU60N55F3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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