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STX13003-AP - STMicroelectronics

Description: Bipolar (BJT) Transistor NPN 400 V 1 A 1.5 W Through Hole TO-92AP

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STX13003-AP - STMicroelectronics - PCB symbol
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PCB Footprints
STX13003-AP - STMicroelectronics PCB footprint - Other - Other - TO-92AP_2025-12
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3D Models
STX13003-AP - STMicroelectronics - 3D model - Other - TO-92AP_2025-12
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STX13003-AP Details

  • Manufacturer Part Number:

    STX13003-AP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92

  • Package Description:

    ROHS COMPLIANT, TO-92AP, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    400 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    5

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    4700 ns

STX13003-AP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a metal shield around the device, keep the PCB layout compact, and use a common mode choke or ferrite bead to filter the power supply. Ensure the device is placed at least 1 mm away from the PCB edge.
  • Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the airflow with components or obstacles. Keep the device temperature below 125°C.
  • Use a clock signal with a frequency tolerance of ±100 ppm and a jitter of less than 100 ps. Ensure the clock signal has a rise and fall time of less than 1 ns.

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STX13003-AP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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