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STZ6.8TT146 - ROHM Semiconductor

Description: Zener arrays for terminal protection devices

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STZ6.8TT146 Details

  • Manufacturer Part Number:

    STZ6.8TT146

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.1

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    40 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Knee Impedance-Max:

    60 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

STZ6.8TT146 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the STZ6.8TT146 is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper soldering, follow the recommended soldering conditions and guidelines provided in the datasheet. Use a soldering iron with a temperature range of 350°C to 370°C, and apply a soldering time of 3 seconds to 5 seconds. Additionally, use a solder with a melting point of 220°C to 240°C.
  • The maximum allowable power dissipation for the STZ6.8TT146 is 1.5W, as specified in the datasheet. Exceeding this limit may cause the device to overheat, leading to reduced performance, reliability issues, or even failure.
  • The STZ6.8TT146 is designed for low-frequency applications, and its performance may degrade at high frequencies. If you need to use it in a high-frequency application, consult with ROHM Semiconductor or a qualified engineer to determine the feasibility and potential modifications required.
  • Handle the STZ6.8TT146 with care during storage and shipping to prevent damage. Store the devices in their original packaging or equivalent, and avoid exposing them to extreme temperatures, humidity, or physical stress.

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STZ6.8TT146 Overview

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