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SUD35N10-26P-BE3 - Vishay

Description: MOSFETs TO252 100V 35A N-CH MOSFET

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SUD35N10-26P-BE3 Details

  • Manufacturer Part Number:

    SUD35N10-26P-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    68 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    55 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    35 A

  • Drain-source On Resistance-Max:

    0.026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    83 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    40 ns

  • Turn-on Time-Max (ton):

    30 ns

SUD35N10-26P-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SUD35N10-26P-BE3 is a standard TO-220 package footprint with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal shock to the device.
  • The maximum allowed voltage derating for the SUD35N10-26P-BE3 is 10% of the maximum rated voltage, which is 260V for this device.
  • The SUD35N10-26P-BE3 is rated for operation up to 150°C. However, it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
  • To protect the SUD35N10-26P-BE3 from electrical overstress, use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device, and ensure that the circuit is designed to limit the voltage and current within the device's ratings.

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SUD35N10-26P-BE3 Overview

Use the download button to access the SUD35N10-26P-BE3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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