SUG80050E-GE3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SUG80050E-GE3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - to-247

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3D Models

SUG80050E-GE3 - Vishay - 3D model - Transistor Outline, Vertical - to-247

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Datasheet Download Datasheet
Stock & Prices Price & Stock for SUG80050E-GE3
Part Number SUG80050E-GE3
Manufacturer Vishay
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Transistor Outline, Vertical
Footprint Name Transistor Outline, Vertical - to-247
Released Date Sep 2, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SUG80050E-GE3 Details

Manufacturer Part Number:
SUG80050E-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Germany
ECCN Code:
EAR99
Date Of Intro:
2017-03-22
Manufacturer:
Vishay Intertechnologies
YTEOL:
6
Avalanche Energy Rating (Eas):
500 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
150 V
Drain Current-Max (ID):
100 A
Drain-source On Resistance-Max:
0.0054 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
65 pF
JEDEC-95 Code:
TO-247
JESD-30 Code:
R-PSFM-T3
Number of Elements:
1
Number of Terminals:
3
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
500 W
Pulsed Drain Current-Max (IDM):
300 A
Surface Mount:
NO
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Turn-off Time-Max (toff):
191 ns
Turn-on Time-Max (ton):
93 ns

SUG80050E-GE3 Frequently Asked Questions (FAQs)

The recommended land pattern for the SUG80050E-GE3 can be found in the Vishay Intertechnologies' application note AN42172, which provides guidelines for PCB layout and assembly.
The SUG80050E-GE3 has a thermal resistance of 2.5°C/W. To ensure proper thermal management, it is recommended to use a heat sink with a thermal interface material and to follow the guidelines outlined in the Vishay Intertechnologies' application note AN10273.
The maximum operating temperature range for the SUG80050E-GE3 is -55°C to 175°C, as specified in the datasheet. However, it is recommended to derate the device's power handling capability at higher temperatures to ensure reliable operation.
Yes, the SUG80050E-GE3 is designed for high-reliability applications and is qualified to the requirements of AEC-Q101, which ensures that the device meets the stringent requirements of the automotive industry.
To ensure proper soldering of the SUG80050E-GE3, follow the recommended soldering profile outlined in the Vishay Intertechnologies' application note AN42171, which provides guidelines for reflow soldering and wave soldering.

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