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SUP60020E-GE3 - Vishay

Description: MOSFET N-Channel 80 V (D-S) MOSFET

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PCB Footprints
SUP60020E-GE3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - to-220ab-ren3
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3D Models
SUP60020E-GE3 - Vishay  - 3D model - Transistor Outline, Vertical - to-220ab-ren3
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SUP60020E-GE3 Details

  • Manufacturer Part Number:

    SUP60020E-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    180 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.0024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    500 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    130 ns

  • Turn-on Time-Max (ton):

    86 ns

SUP60020E-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SUP60020E-GE3 is a pad layout with a minimum size of 2.5mm x 1.5mm, with a 0.5mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • Yes, SUP60020E-GE3 is designed to operate in high-temperature environments up to 150°C. However, it's crucial to ensure that the device is properly derated to prevent overheating and to follow the recommended thermal management guidelines.
  • To ensure the reliability of SUP60020E-GE3 in high-reliability applications, it's essential to follow the recommended storage and handling guidelines, use proper soldering techniques, and ensure that the device is operated within its specified ratings and parameters.
  • Yes, SUP60020E-GE3 is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and temperature guidelines to ensure proper solder joint formation and to prevent damage to the device.
  • The typical response time of SUP60020E-GE3 to overvoltage events is less than 1μs. This fast response time helps to protect the downstream circuitry from voltage transients and surges.

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SUP60020E-GE3 Overview

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