- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SUP70060E-GE3
- Part Number SUP70060E-GE3
- Manufacturer Vishay
- Pin Count 3
- Part Category MOSFET (N-Channel)
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO-220AB (Height 4.65)
- Released Date Dec 30, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SUP70060E-GE3 Details
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Manufacturer Part Number:
SUP70060E-GE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
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ECCN Code:
EAR99
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Factory Lead Time:
29 Weeks
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Date Of Intro:
2016-05-02
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5.3
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Avalanche Energy Rating (Eas):
125 mJ
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Configuration:
SINGLE WITH BUILT-IN DIODE
SUP70060E-GE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for SUP70060E-GE3 is a rectangle with dimensions 2.5 mm x 1.3 mm, with a thermal pad size of 1.5 mm x 1.3 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
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To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves, ensure proper thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermally conductive interface material and a heat sink to dissipate heat efficiently.
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The maximum allowed voltage transient for SUP70060E-GE3 is 80 V for a duration of less than 100 ms. Exceeding this limit may cause damage to the device. It's essential to ensure that the input voltage is within the recommended range and to use proper voltage transient protection measures.
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Yes, you can use multiple SUP70060E-GE3 devices in parallel to increase the current handling capability. However, it's essential to ensure that the devices are properly matched, and the current sharing is balanced to prevent overheating and reduce the overall reliability.
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The recommended storage condition for SUP70060E-GE3 is to store the devices in a dry, cool place with a relative humidity of less than 60% and a temperature range of -40°C to 30°C. It's also essential to follow the recommended baking procedure before soldering to prevent moisture-related issues.
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SUP70060E-GE3 Overview
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