The recommended PCB footprint for SUP90100E-GE3 is a rectangle with dimensions of 2.5 mm x 1.3 mm, with a thermal pad size of 1.5 mm x 1.3 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
To ensure the reliability of the SUP90100E-GE3 in high-temperature applications, it's crucial to follow the recommended operating temperature range (up to 150°C) and to provide adequate heat sinking. Additionally, ensure that the device is not exposed to thermal shocks, and that the PCB is designed to minimize thermal resistance.
The maximum allowed voltage derating for the SUP90100E-GE3 is 10% of the maximum rated voltage (100 V). This means that the device can operate safely up to 90 V, but it's recommended to derate the voltage further to ensure reliability and to prevent electrical overstress.
Yes, you can use the SUP90100E-GE3 in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the devices are properly matched, and that the PCB is designed to minimize current imbalance and thermal mismatch between the devices.
The recommended storage condition for the SUP90100E-GE3 is to store the devices in a dry, cool place with a relative humidity of 50% or less. It's also recommended to store the devices in their original packaging or in a moisture-proof bag to prevent moisture absorption.
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SUP90100E-GE3 Overview
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