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SURS8360T3G - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Shipped in 16 mm Tape and Reel, 25

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PCB Footprints
SURS8360T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE B
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SURS8360T3G - onsemi  - 3D model - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE B
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SURS8360T3G Details

  • Manufacturer Part Number:

    SURS8360T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SMC

  • Pin Count:

    2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.28 V

  • JESD-30 Code:

    R-PDSO-J2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SURS8360T3G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, component selection, and assembly to minimize thermal resistance.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature protection, over-current protection, and under-voltage lockout to ensure reliable operation.
  • Use a low-ESR output capacitor, minimize PCB trace inductance, and optimize the device's layout for minimal parasitic inductance. Ensure proper selection of external components, such as the bootstrap capacitor and diode.
  • Choose a high-quality output capacitor with low ESR and ESL. Select a bootstrap capacitor with a high voltage rating and low ESR. Ensure the diode has a fast recovery time and low forward voltage drop.

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SURS8360T3G Overview

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