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SVD5865NLT4G - onsemi

Description: Low On Resistance; High Current Capability; Avalanche Energy Specified; AEC−Q101 Qualified; RoHS Compliant

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SVD5865NLT4G - onsemi - PCB symbol
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PCB Footprints
SVD5865NLT4G - onsemi PCB footprint - Other - Other - DPAK (SINGLE GUAGE) CASE 369AA−01 ISSUE B_2020
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SVD5865NLT4G Details

  • Manufacturer Part Number:

    SVD5865NLT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AA

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    36 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain-source On Resistance-Max:

    0.019 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    203 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SVD5865NLT4G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Place input and output capacitors as close to the device as possible. Ensure the capacitors are connected to the correct pins and are of the recommended type (e.g., X5R or X7R for input capacitors).
  • Use a shielded enclosure, keep sensitive components away from the SVD5865NLT4G, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Add test points for input/output voltages, currents, and temperatures. Use an oscilloscope with a bandwidth of at least 100 MHz for signal integrity analysis.

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SVD5865NLT4G Overview

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