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SWPA4030S100MT - SUNLORD

Description: 10 µH Shielded Drum Core, Wirewound Inductor 1.5 A 130mOhm Max Nonstandard (l*w*h) (4*4*3)

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SWPA4030S100MT - SUNLORD PCB footprint - Other - Other - SWPA4030S
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SWPA4030S100MT - SUNLORD  - 3D model - Other - SWPA4030S
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SWPA4030S100MT Details

  • Manufacturer Part Number:

    SWPA4030S100MT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sunlord

  • YTEOL:

    7.3

  • Case/Size Code:

    1616

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.13 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3 mm

  • Package Length:

    4 mm

  • Package Style:

    SMT

  • Package Width:

    4 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    1.5 A

  • Self Resonance Frequency:

    21 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SWPA4030S100MT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The component should be placed near the edge of the board to minimize radiation. A via-stitching technique can be used to connect the ground plane to the chassis.
  • Use a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed as close as possible to the device. The capacitors should be connected between the power pin and the ground pin.
  • The maximum operating temperature range for the SWPA4030S100MT is -40°C to 125°C. However, the device's performance may degrade at temperatures above 85°C.
  • Yes, but the device should be coated with a moisture-resistant material to prevent moisture ingress. The device should also be stored in a dry environment to prevent moisture absorption.
  • Use a shielded enclosure and ensure the device is properly grounded. The PCB should be designed to minimize radiation and the device should be placed away from other components that may be susceptible to EMI.

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SWPA4030S100MT Overview

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