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SWPA8065S220MT - SUNLORD

Description: FIXED IND 22UH 2.7A 72 MOHM SMD

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PCB Footprints
SWPA8065S220MT - SUNLORD PCB footprint - Other - Other - SWPA8065S220MT-4
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3D Models
SWPA8065S220MT - SUNLORD  - 3D model - Other - SWPA8065S220MT-4
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SWPA8065S220MT Details

  • Manufacturer Part Number:

    SWPA8065S220MT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sunlord

  • YTEOL:

    6.7

  • Case/Size Code:

    3131

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.072 Ω

  • Inductance-Nom (L):

    22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.5 mm

  • Package Length:

    8 mm

  • Package Style:

    SMT

  • Package Width:

    8 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    2.7 A

  • Self Resonance Frequency:

    8 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SWPA8065S220MT Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the component on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A thermal pad on the bottom of the component should be connected to a copper area on the PCB to improve heat dissipation.
  • To ensure reliability and longevity, it's essential to follow the recommended operating temperature range, provide adequate heat dissipation, and avoid thermal shocks. Additionally, using a conformal coating and following proper storage and handling procedures can help prevent damage.
  • The recommended soldering conditions are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. It's also important to use a solder with a melting point above 217°C to prevent damage to the component.
  • Yes, the SWPA8065S220MT can be used in high-vibration environments, but it's essential to ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, the PCB should be designed to withstand the vibration and shock conditions.
  • The component should be stored in a dry, cool place, away from direct sunlight and moisture. It's essential to handle the component by the body, avoiding touching the pins or electrical connections. Anti-static precautions should also be taken to prevent ESD damage.

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SWPA8065S220MT Overview

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