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SY100ELT22LZG-TR - Microchip

Description: Translation - Voltage Levels 3.3V Dual TTL-to-Differential PECL Translator

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SY100ELT22LZG-TR - Microchip - PCB symbol
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PCB Footprints
SY100ELT22LZG-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SOICN-8LD-PL-1_2023
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SY100ELT22LZG-TR - Microchip - 3D model - Small Outline Packages - SOICN-8LD-PL-1_2023
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SY100ELT22LZG-TR Details

  • Manufacturer Part Number:

    SY100ELT22LZG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Delay-Max:

    0.6 ns

  • Interface IC Type:

    TTL/CMOS TO PECL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max:

    25 mA

  • Supply Voltage-Max:

    3.8 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

SY100ELT22LZG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the SY100ELT22LZG-TR involves keeping the input and output traces short and direct, using a solid ground plane, and minimizing noise coupling. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Proper power supply decoupling is crucial for the SY100ELT22LZG-TR. Use a low-ESR capacitor (e.g., 0.1 μF) close to the VCC pin, and consider adding a 10 μF capacitor in parallel for additional filtering. Ensure the power supply is stable and within the recommended operating range.
  • The SY100ELT22LZG-TR has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating in high-temperature environments or under high-power conditions.
  • When troubleshooting the SY100ELT22LZG-TR, start by verifying the power supply and clock signals. Check for proper termination and signal integrity. Use an oscilloscope to inspect the input and output signals, and consult the datasheet and application notes for guidance on specific issues.
  • Yes, the SY100ELT22LZG-TR is a high-frequency device and requires attention to EMI/EMC considerations. Use shielding, filtering, and proper grounding to minimize emissions and susceptibility. Follow good PCB design practices, and consider using EMI-absorbing materials or shielding cans if necessary.

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SY100ELT22LZG-TR Overview

Use the download button to access the SY100ELT22LZG-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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