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SY58606UMG - Microchip

Description: SY58606UMG, Clock Buffer, 16-Pin MLF

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PCB Footprints
SY58606UMG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-PIN QFN_1
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3D Models
SY58606UMG - Microchip  - 3D model - Quad Flat No-Lead - 16-PIN QFN_1
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SY58606UMG Details

  • Manufacturer Part Number:

    SY58606UMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MLF-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    CAN ALSO OPERATE WITH 3.3V SUPPLY

  • Family:

    58606

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    77 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

  • fmax-Min:

    3000 MHz

SY58606UMG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 0.1 μF and 10 μF) placed close to the device. Ensure the power supply is stable and well-regulated to prevent voltage droop.
  • Use the device's power-saving features such as dynamic voltage and frequency scaling, and clock gating. Optimize the system's power management strategy to minimize idle power consumption.
  • Use a shielded enclosure, keep sensitive signals away from the PCB edge, and use EMI filters or common-mode chokes on I/O lines. Ensure proper grounding and bonding of the PCB and enclosure.

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SY58606UMG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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