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SY75572LMG - Microchip

Description: Clock Buffer 2-Output HCSL PCIe Buffer With Hi Drive

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SY75572LMG - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - SY75572LMG
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SY75572LMG Details

  • Manufacturer Part Number:

    SY75572LMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Family:

    75572

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    3 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SY75572LMG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks short and away from each other to minimize noise and coupling.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) as close as possible to the VCC pin. Add additional decoupling capacitors (e.g., 100nF) near the device to filter out high-frequency noise.
  • The maximum power dissipation is dependent on the ambient temperature and the thermal resistance of the package. For the SY75572LMG, the maximum power dissipation is approximately 1.5W at 25°C ambient temperature.
  • Use an oscilloscope to monitor the input and output signals. Check for proper power supply decoupling, ensure the PCB layout is correct, and verify that the input signals are within the specified range. Consult the datasheet and application notes for additional guidance.
  • The SY75572LMG is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature operation.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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