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SY89311UMG-TR - Microchip

Description: Buffers & Line Drivers 2.5V/3.3V/5V Ultra-small 1:2 LVPECL Fanout Buffer

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SY89311UMG-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - SY89311UMG-TRa
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SY89311UMG-TR - Microchip  - 3D model - Small Outline No-lead - SY89311UMG-TRa
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SY89311UMG-TR Details

  • Manufacturer Part Number:

    SY89311UMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN, SOLCC8,.08,20

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ECL MODE: VCC = 0V, VEE = -2.375V TO -2.625V; ALSO OPERATES AT 3.3V OR 5V SUPPLY

  • Family:

    89311

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.36 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    0.9754 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

  • fmax-Min:

    3000 MHz

SY89311UMG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the SY89311UMG-TR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper powering and decoupling, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device's power pins. Also, ensure the power plane is well-decoupled from the ground plane.
  • The SY89311UMG-TR has an operating temperature range of -40°C to +85°C. However, it's recommended to operate the device within a temperature range of 0°C to +70°C for optimal performance and reliability.
  • To troubleshoot issues with the SY89311UMG-TR, start by checking the power supply and decoupling, then verify the input and output signals using an oscilloscope. Check for any signs of overheating, and ensure the device is properly soldered and mounted on the PCB.
  • While the SY89311UMG-TR is a high-performance device, it's essential to consult with Microchip Technology Inc. or a qualified reliability engineer to determine its suitability for high-reliability or aerospace applications. Additional testing and qualification may be required.

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SY89311UMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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