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SZ1SMA5920BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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PCB Footprints
SZ1SMA5920BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5920BT3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5920BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5920BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    6.2 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    4 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    60.5 mA

SZ1SMA5920BT3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to moisture or humidity, which can affect reliability.
  • A 10 μF to 22 μF ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close as possible to the input pins to minimize noise and ensure stable operation.
  • Use a shielded enclosure or a metal can package to minimize EMI. Ensure that the device is placed away from noise sources and antennas. Use a common-mode choke or ferrite bead to filter out high-frequency noise on the input lines.
  • The maximum allowed voltage on the input pins is 30 V. Exceeding this voltage can damage the device. Ensure that the input voltage is within the recommended range to ensure reliable operation.

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SZ1SMA5920BT3G Overview

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