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SZ1SMB24AT3G - LITTELFUSE

Description: Littelfuse SZ1SMB24AT3G, Uni-Directional TVS Diode, 600W, 2-Pin DO-214AA

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PCB Footprints
SZ1SMB24AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - SMB case 403A-03
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3D Models
SZ1SMB24AT3G - LITTELFUSE  - 3D model - Diodes Moulded - SMB case 403A-03
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SZ1SMB24AT3G Details

  • Manufacturer Part Number:

    SZ1SMB24AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    29.5 V

  • Breakdown Voltage-Min:

    26.7 V

  • Breakdown Voltage-Nom:

    28.1 V

  • Clamping Voltage-Max:

    38.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZ1SMB24AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SZ1SMB24AT3G can be found in the Littelfuse application note AN9313, which provides guidelines for PCB layout and assembly.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating curves provided in the datasheet, and to consider the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal management and heat sinking to prevent overheating.
  • The maximum surge current rating for the SZ1SMB24AT3G is 24A, as specified in the datasheet. However, it's essential to consider the duration and frequency of the surge events to ensure the device can withstand the stress.
  • Yes, the SZ1SMB24AT3G can be used in a parallel configuration to increase the current handling capability. However, it's crucial to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce reliability.
  • To prevent ESD damage, it is recommended to store the SZ1SMB24AT3G in its original packaging or in a static-shielding bag. Handle the devices with ESD-protective materials, and ensure that the workspace and personnel are grounded to prevent static buildup.

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