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SZ1SMB30AT3G - onsemi

Description: TVS Diodes - Transient Voltage Suppressors ZEN SMB TVS 600W SPCL TR

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SZ1SMB30AT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMB30AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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3D Models
SZ1SMB30AT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SZ1SMB30AT3G Details

  • Manufacturer Part Number:

    SZ1SMB30AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW ZENER IMPEDANCE

  • Breakdown Voltage-Max:

    36.8 V

  • Breakdown Voltage-Min:

    33.3 V

  • Breakdown Voltage-Nom:

    35.05 V

  • Clamping Voltage-Max:

    48.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZ1SMB30AT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMB30AT3G is a standard SOD-123 package with a pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
  • The maximum allowable voltage stress on the SZ1SMB30AT3G is 33V, which is the maximum rated voltage of the device. Exceeding this voltage may cause permanent damage or degradation of the device.
  • The SZ1SMB30AT3G is rated for operation up to 150°C junction temperature. At high temperatures, the device's leakage current may increase, and its breakdown voltage may decrease. Ensure proper thermal management and heat sinking to maintain reliable operation.
  • The SZ1SMB30AT3G is designed for low-frequency applications up to 100 kHz. While it may be possible to use it in higher-frequency applications, the device's performance and reliability may be compromised. Consult the datasheet and application notes for guidance on high-frequency usage.

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SZ1SMB30AT3G Overview

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