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SZ1SMB5913BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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PCB Footprints
SZ1SMB5913BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - 403-A
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3D Models
SZ1SMB5913BT3G - onsemi  - 3D model - Diodes Moulded - 403-A
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SZ1SMB5913BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5913BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    113.6 mA

SZ1SMB5913BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB layout is to keep the power and ground planes separate, with a minimum of 10mm clearance between them. Additionally, use a ground plane with a thickness of at least 0.5mm and a power plane with a thickness of at least 0.3mm. Also, ensure that the PCB has a sufficient ground plane area to reduce inductance and minimize EMI.
  • The SZ1SMB5913BT3G is designed for high-frequency applications up to 100MHz. However, it's recommended to derate the device's frequency response by 10% to ensure reliable operation. Additionally, consider using a bypass capacitor with a value of at least 10nF and a low ESR to reduce noise and improve high-frequency performance.
  • For high-power applications, it's recommended to use a heat sink with a thermal resistance (Rth) of 0.5°C/W or lower. Additionally, ensure that the PCB has a sufficient thermal interface material (TIM) to reduce thermal resistance. Consider using a fan or other cooling mechanism to maintain a temperature below 125°C.
  • The SZ1SMB5913BT3G is designed to operate in environments with moderate vibration levels (up to 10G). However, for high-vibration environments (above 10G), it's recommended to use a vibration-isolated mounting system and ensure that the PCB is securely fastened to the chassis.
  • Store the SZ1SMB5913BT3G in its original packaging in a dry, cool environment (below 30°C and 60% RH). Handle the device with care to avoid physical damage. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage and handling.

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SZ1SMB5913BT3G Overview

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