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SZ1SMB5935BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5935BT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMB5935BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SZ1SMB5935BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SZ1SMB5935BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5935BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    23 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    27 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    13.9 mA

SZ1SMB5935BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMB5935BT3G involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, and use a stable voltage source. The input voltage should be within the recommended range, and the output voltage should be properly terminated to prevent oscillations.
  • The SZ1SMB5935BT3G has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or heat sink, and to keep the device away from heat sources.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an ESD wrist strap, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • The SZ1SMB5935BT3G is manufactured by onsemi, which adheres to strict quality and reliability standards, including ISO 9001 and AEC-Q101. The device is also qualified to automotive standards, ensuring high reliability and performance.

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SZ1SMB5935BT3G Overview

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