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SZ1SMB5937BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5937BT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMB5937BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5937BT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5937BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5937BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    800 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    25.1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    11.4 mA

SZ1SMB5937BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMB5937BT3G is a standard SOD-123 package with a pad size of 0.8mm x 0.8mm and a spacing of 0.5mm between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper biasing, connect the anode (A) to a stable voltage source, and the cathode (K) to a low-impedance ground. The recommended operating voltage is between 5V and 24V, with a maximum voltage rating of 30V. Additionally, ensure the device is operated within the recommended temperature range of -55°C to 150°C.
  • The SZ1SMB5937BT3G has a maximum surge current rating of 40A for a 10/1000μs waveform, as per the IEC 61000-4-5 standard. This rating ensures the device can withstand high surge currents without damage or degradation.
  • Yes, the SZ1SMB5937BT3G is suitable for high-frequency applications up to 1GHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the PCB layout to minimize signal degradation and ensure optimal performance.
  • The typical junction-to-ambient thermal resistance (RθJA) for the SZ1SMB5937BT3G is around 120°C/W. This value indicates the device's ability to dissipate heat, and it's essential to consider it when designing the thermal management system to prevent overheating.

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SZ1SMB5937BT3G Overview

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