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SZ1SMB5947BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5947BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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SZ1SMB5947BT3G - onsemi  - 3D model - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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SZ1SMB5947BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5947BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    160 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    82 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    4.6 mA

SZ1SMB5947BT3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the SZ1SMB5947BT3G would be to use a ground plane, keep the leads as short as possible, and use a common cathode configuration to minimize parasitic inductance and capacitance. Additionally, it's recommended to use a 1-2 mm wide trace for the anode and cathode connections.
  • To ensure proper soldering and avoid thermal damage, use a soldering iron with a temperature range of 250-260°C, and a solder with a melting point of 180-190°C. Apply a small amount of solder to the anode and cathode pins, and use a soldering technique that minimizes the time the iron is in contact with the component. Avoid using excessive force or pressure, which can cause damage to the internal bonds.
  • The maximum surge current rating for the SZ1SMB5947BT3G is 58A for a 10/1000 μs waveform, as per the IEC 61000-4-5 standard. However, it's recommended to derate the surge current based on the specific application and environmental conditions.
  • While the SZ1SMB5947BT3G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance. It's recommended to consult with onsemi's application engineers for specific guidance on high-frequency applications.
  • The recommended operating temperature range for the SZ1SMB5947BT3G is -55°C to 150°C. However, the device's performance and reliability may degrade if operated outside this range. It's recommended to consult with onsemi's application engineers for specific guidance on operating temperature ranges.

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SZ1SMB5947BT3G Overview

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