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SZ1SMB5953BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5953BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SZ1SMB5953BT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SZ1SMB5953BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5953BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    600 Ω

  • JESD-30 Code:

    R-PDSO-L2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    150 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    2.5 mA

SZ1SMB5953BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMB5953BT3G should consider the following: keep the input and output traces short and separate, use a solid ground plane, and place a 1-2uF decoupling capacitor close to the device. Additionally, ensure that the PCB material has a high thermal conductivity to dissipate heat efficiently.
  • To ensure the SZ1SMB5953BT3G operates within its SOA, monitor the device's voltage, current, and power dissipation. Avoid exceeding the maximum ratings, and use a thermal management system to keep the junction temperature below 150°C. Also, consider using a current limiter or a fuse to prevent overcurrent conditions.
  • Store the SZ1SMB5953BT3G in a dry, cool place with a temperature range of -40°C to 125°C. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
  • Yes, the SZ1SMB5953BT3G is suitable for high-reliability and automotive applications. It meets the AEC-Q101 qualification standard for automotive-grade devices and is designed to operate in harsh environments. However, ensure that you follow the recommended operating conditions, PCB layout, and thermal management guidelines to ensure reliable operation.
  • To troubleshoot issues with the SZ1SMB5953BT3G, follow a systematic approach: 1) Verify the PCB layout and assembly, 2) Check the input and output voltages, 3) Monitor the device's temperature, 4) Verify the current consumption, and 5) Consult the datasheet and application notes for guidance. If the issue persists, contact onsemi's technical support for further assistance.

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SZ1SMB5953BT3G Overview

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