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SZ1SMB5956BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5956BT3G - onsemi PCB footprint - Other - Other - SZ1SMB5956BT3G-1
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SZ1SMB5956BT3G - onsemi  - 3D model - Other - SZ1SMB5956BT3G-1
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SZ1SMB5956BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5956BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    1200 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    8000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    200 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    152 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    1.9 mA

SZ1SMB5956BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMB5956BT3G involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper biasing, the SZ1SMB5956BT3G requires a stable input voltage (VIN) and a stable output voltage (VOUT). The input voltage should be within the recommended range (typically 2.5V to 5.5V), and the output voltage should be set using a resistive divider network. It's also important to ensure the device is operated within its recommended operating temperature range.
  • The SZ1SMB5956BT3G has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device away from heat sources. Additionally, it's recommended to operate the device within its recommended operating temperature range to prevent thermal shutdown.
  • The SZ1SMB5956BT3G requires proper power sequencing to prevent damage or malfunction. The input voltage (VIN) should be applied before the enable pin (EN) is asserted, and the output voltage (VOUT) should be monitored to ensure it reaches its nominal value before the load is connected.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), it's recommended to use a shielded layout, keep the device away from noise sources, and use filtering components such as capacitors and inductors to reduce noise and radiation.

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SZ1SMB5956BT3G Overview

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