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SZBZX84B12LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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Symbol
SZBZX84B12LT1G - onsemi - PCB symbol
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PCB Footprints
SZBZX84B12LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SZBZX84B12LT1G
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3D Models
SZBZX84B12LT1G - onsemi - 3D model - SOT23 (3-Pin) - SZBZX84B12LT1G
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SZBZX84B12LT1G Details

  • Manufacturer Part Number:

    SZBZX84B12LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    25 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    12 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    10 mV/°C

  • Voltage Tol-Max:

    1.67%

  • Working Test Current:

    5 mA

SZBZX84B12LT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZBZX84B12LT1G is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm lead pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, the device should be operated within its specified temperature range of -40°C to 150°C.
  • The maximum allowed voltage on the input pins of the SZBZX84B12LT1G is 12V. Exceeding this voltage may cause damage to the device or affect its reliability.
  • Yes, the SZBZX84B12LT1G can be used in switching regulator applications. However, it is essential to ensure that the device is operated within its specified voltage and current ratings, and that proper filtering and decoupling are implemented to minimize electromagnetic interference (EMI).
  • The typical turn-on and turn-off time for the SZBZX84B12LT1G is around 10-20ns. However, this may vary depending on the specific application, PCB layout, and operating conditions.

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SZBZX84B12LT1G Overview

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