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SZBZX84C18ET1G - onsemi

Description: Peak Power Dissipation 225 Watt (8 X 20 µs); ESD Rating of Class 3 (>16 KV) per Human Body Model; Pb-Free Packages are Available; AECQ101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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PCB Footprints
SZBZX84C18ET1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SZBZX84C18ET1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SZBZX84C18ET1G Details

  • Manufacturer Part Number:

    SZBZX84C18ET1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    225 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101; UL RECOGNIZED

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    12.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    16 mV/°C

  • Voltage Tol-Max:

    6.41%

  • Working Test Current:

    5 mA

SZBZX84C18ET1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZBZX84C18ET1G is a standard SOT23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • To ensure proper biasing, connect the input pin to a stable voltage source, and ensure the output pin is connected to a suitable load impedance. Refer to the datasheet for specific biasing requirements.
  • The maximum power dissipation for the SZBZX84C18ET1G is 250mW. Ensure that the device is properly heat-sinked and operated within the recommended temperature range to avoid overheating.
  • Yes, the SZBZX84C18ET1G is suitable for high-frequency applications up to 100MHz. However, ensure that the device is properly decoupled and the PCB layout is optimized for high-frequency operation.
  • The SZBZX84C18ET1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.

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