Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a thermal relief pattern under the package. A minimum of 10 thermal vias under the package is recommended, with a via diameter of 0.3 mm and a pitch of 0.5 mm.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rated temperature.
To prevent ESD damage, it is recommended to use a human body model (HBM) ESD protection circuit at the input pins, with a minimum of 2 kV HBM rating. Additionally, ensure that the PCB design includes ESD protection diodes and resistors as per the onsemi application note.
Yes, the SZBZX84C36LT1G is qualified for automotive and high-reliability applications. However, it is recommended to consult with onsemi's quality and reliability team to ensure that the device meets the specific requirements of your application.
The recommended soldering conditions for the SZBZX84C36LT1G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. Ensure that the soldering process is in accordance with the IPC-J-STD-001 standard.
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SZBZX84C36LT1G Overview
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