Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
The recommended PCB footprint for the SZBZX84C8V2LT1G is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm lead pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
To ensure the SZBZX84C8V2LT1G operates within its SOA, follow the recommended operating conditions outlined in the datasheet, including voltage, current, and power dissipation limits. Additionally, consider thermal management and heat sinking to prevent overheating.
The SZBZX84C8V2LT1G has built-in ESD protection diodes, but it's still recommended to follow proper ESD handling and storage procedures. For latch-up prevention, ensure the device is operated within its recommended voltage and current ranges, and consider adding external protection circuits if necessary.
The SZBZX84C8V2LT1G is a commercial-grade device, but onsemi offers automotive-grade and high-reliability versions of similar products. Contact onsemi for more information on their AEC-Q101 qualified or high-reliability variants.
The optimal biasing and termination for the SZBZX84C8V2LT1G depend on the specific application and circuit requirements. Consult the datasheet and application notes for general guidelines, and consider simulation tools or consulting with an onsemi FAE for customized support.
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SZBZX84C8V2LT1G Overview
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