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SZCM1213A-04SO - onsemi

Description: Low Capacitance ESD Protection Array

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SZCM1213A-04SO - onsemi  - 3D model
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SZCM1213A-04SO Details

  • Manufacturer Part Number:

    SZCM1213A-04SO

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74

  • Package Description:

    SC-74, 6 PIN

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Clamping Voltage-Max:

    9.9 V

  • Configuration:

    COMMON ANODE, 5 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZCM1213A-04SO Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the thermal derating curves provided in the datasheet to ensure the device does not exceed the maximum junction temperature (Tj) of 150°C.
  • Use a human body model (HBM) ESD protection circuit at the input pins, and consider adding a TVS (transient voltage suppressor) diode for additional protection. Follow the onsemi application note for ESD protection guidelines.
  • Yes, the SZCM1213A-04SO is AEC-Q101 qualified, making it suitable for automotive applications. However, ensure that the device is used within the recommended operating conditions and that the PCB design meets the required reliability standards.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%.

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SZCM1213A-04SO Overview

Use the download button to access the SZCM1213A-04SO 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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