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SZESD7361P2T5G - onsemi

Description: Low Capacitance 0.55pF Max; Protection for IEC61000-4-2 (Level 4); Protection for IEC61000-4-4 (EFT): 40A (5/50ns); Protection for IEC61000-4-5 (Lightning): 1A (8/20us); Protection for ISO10605 330pF/2kΩ ±15kV Contact; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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SZESD7361P2T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−923
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SZESD7361P2T5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−923
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SZESD7361P2T5G Details

  • Manufacturer Part Number:

    SZESD7361P2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923-2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.06

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Min:

    16.5 V

  • Clamping Voltage-Max:

    34 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    16 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD7361P2T5G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal interface material (TIM) and a heat sink if possible.
  • Use a shielded enclosure, keep sensitive traces away from the device, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a maximum ESR of 100mΩ for input and output filtering. Ensure the capacitors are placed close to the device and connected to the correct pins.
  • Use a voltage supervisor or a dedicated overvoltage protection (OVP) and undervoltage protection (UVP) circuit to prevent damage from voltage transients or faults. Ensure the protection circuitry is designed to respond quickly and accurately.
  • Use a heat sink with a thermal interface material (TIM) and ensure good airflow around the device. Consider using a thermally enhanced package or a device with a higher junction-to-case thermal resistance (RθJC) rating.

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