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SZESD7462N2T5G - onsemi

Description: Industry Leading Capacitance Linearity Over Voltage; Ultra−Low Capacitance: 0.3 pF Typ; Insertion Loss: 0.05 dB at 1 GHz; 0.21 dB at 3 GHz; Low Leakage: < 1 nA; IEC61000−4−2 (ESD): Level 4 ±15 kV Contact; IEC61000−4−4 (EFT): 40 A −5/50 ns; IEC61000−4−5 (Lightning): 1 A (8/20 ?s); ISO 10605 (ESD) 330 pF/2 k? ±20 kV Contact; SZESD7462MXWT5G Wettable Flank Package; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These D

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SZESD7462N2T5G - onsemi PCB footprint - Other - Other - SZESD7462N2T5G-1
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SZESD7462N2T5G Details

  • Manufacturer Part Number:

    SZESD7462N2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.79

  • Breakdown Voltage-Max:

    28 V

  • Breakdown Voltage-Min:

    16.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    16 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD7462N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD7462N2T5G should prioritize thermal dissipation. Ensure a solid ground plane, use thermal vias, and keep the component away from heat sources. A 2-3 layer board with a dedicated thermal layer is recommended.
  • For high-temperature operation, ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions. Consider using a heat sink with a thermal resistance of ≤ 10°C/W.
  • The SZESD7462N2T5G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is properly grounded during handling.
  • Yes, the SZESD7462N2T5G is suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions, and consider additional testing and validation for your specific use case.
  • Follow the recommended soldering profile: peak temperature ≤ 260°C, time above 217°C ≤ 30 seconds. For rework, use a low-temperature soldering iron (≤ 350°C) and avoid applying excessive force or heat.

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