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SZESD7471N2T5G - onsemi

Description: ON SEMICONDUCTOR - SZESD7471N2T5G - ESD Protection Device, 15 V, XDFN, 2 Pins, 300 mW, ESD7471 Series

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SZESD7471N2T5G - onsemi PCB footprint - Other - Other - XDFN2_2021
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SZESD7471N2T5G - onsemi  - 3D model - Other - XDFN2_2021
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SZESD7471N2T5G Details

  • Manufacturer Part Number:

    SZESD7471N2T5G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    XDFN-2

  • Manufacturer Package Code:

    711AM

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5.3 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    5.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL GOLD PALLADIUM

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD7471N2T5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD7471N2T5G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to a logic high (VCC) to enable the device. Additionally, decouple the VCC pin with a 0.1uF ceramic capacitor to reduce noise and ensure stable operation.
  • The SZESD7471N2T5G is rated for operation from -40°C to 125°C. However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • The SZESD7471N2T5G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment.
  • Store the SZESD7471N2T5G in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the relative humidity should be below 60%.

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SZESD7471N2T5G Overview

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