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SZESD8551MXWT5G - onsemi

Description: Low Capacitance (0.30 pF Max, I/O to GND); Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) ISO10605 330 pF / 2 k? ±30 kV Contact; Low ESD Clamping Voltage; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; SZESD8551MXWT5G Wettable Flank Package

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SZESD8551MXWT5G - onsemi PCB footprint - Other - Other - SZESD8551MXWT5G-1
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SZESD8551MXWT5G Details

  • Manufacturer Part Number:

    SZESD8551MXWT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFNW2

  • Package Description:

    X2DFNW-2

  • Manufacturer Package Code:

    711BG

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2020-01-27

  • Manufacturer:

    onsemi

  • YTEOL:

    6.44

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8.3 V

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    7.9 V

  • Clamping Voltage-Max:

    16 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD8551MXWT5G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor for temperature monitoring.
  • Use a shielded enclosure, and ensure proper PCB layout and grounding. Implement EMI filters and shielding on I/O lines, and consider using a common-mode choke.
  • Implement a power-saving mode, reduce switching frequency, and optimize the output capacitor selection. Consider using a low-dropout regulator for the internal voltage regulator.
  • Use a 4-point Kelvin connection for accurate voltage and current measurements. Ensure proper probe placement and consider using a high-bandwidth oscilloscope for signal integrity analysis.

Trust Checks

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